IBM technician Asia Dent, Poughkeepsie, N.Y. , tests two multi-chip modules that will each power one of IBMs new zEnterprise System mainframes. Each ceramic module forms the central processing unit of the new computer and packs 96 of the worlds fastest microprocessors (5.2 Ghz) together to give the new mainframe 60 percent faster performance than its predecessor
US computer giant IBM and South Korean electronics titan Samsung on Wednesday announced they will begin working together on ways to make better chips for smartphones and other gadgets.
Samsung researchers will team with scientists at the IBM Semiconductor Research Alliance in New York State to create computer processor “solutions that are optimized for performance, power consumption, and size.”
“Collaborative innovation will be critical if the semiconductor industry is to continue driving new forms of consumer electronics and new methods of computing,” said IBM microelectronics general manager Michael Cadigan.
“That’s why we’re excited to have Samsung scientists working with us at the most fundamental stages of the R&D process.” The companies are striving to develop chips to power a high-performance generation of “smarter, connected and more mobile” devices.
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